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Inventor profile of:

Mark E. Henschel

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2026-03-12

Top Assignees for applications by Mark E. Henschel

The entities that hold a legal rights for patent applications filed by inventor Henschel Mark E.:

Medtronic, Inc. 18 Minneapolis, MN United States
MEDTRONIC CRYOCATH LP 1 Toronto, Canada
Warsaw Orthopedic, Inc. 1 Warsaw, IN United States

Recent patent applications by Henschel Mark E.

Mark E. Henschel from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12

US20260069357A1

Human necessities

METHOD FOR APPLYING CONDUCTORS TO CATHETER BASED BALLOONS

#2 | 2025-06-05

US20250183203A1

Electricity

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

#3 | 2025-06-05

US20250177760A1

Human necessities

FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME

#4 | 2024-11-21

US20240382723A1

Human necessities

System And Method For Valve Control

#5 | 2024-05-23

US20240165416A1

Human necessities

ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE

#6 | 2024-05-02

US20240145322A1

Electricity

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

#7 | 2024-04-25

US20240131625A1

Performing operations; transporting

Hermetic assembly and device including same

#8 | 2023-08-10

US20230248982A1

Human necessities

FEEDTHROUGH ASSEMBLY AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

#9 | 2023-07-13

US20230218911A1

Human necessities

Feedthrough assembly and device including same

#10 | 2022-08-04

US20220241598A1

Human necessities

Feedthrough header assembly and device including same

#11 | 2022-05-19

US20220158021A1

Electricity

INTEGRATED CIRCUIT PACKAGE AND SYSTEM USING SAME

#12 | 2022-05-19

US20220157676A1

Electricity

Method of forming integrated circuit package

#13 | 2022-03-10

US20220077085A1

Electricity

Electronic package and implantable medical device including same

#14 | 2022-01-06

US20220000550A1

Human necessities

METHOD FOR APPLYING CONDUCTORS TO CATHETER BASED BALLOONS

#15 | 2021-06-24

US20210187307A1

Human necessities

Feedthrough assembly and device including same

#16 | 2021-06-17

US20210178518A1

Performing operations; transporting

Hermetic assembly and device including same

#17 | 2021-05-27

US20210159131A1

Electricity

Die carrier package and method of forming same

#18 | 2021-05-27

US20210154772A1

Performing operations; transporting

Laser cutting system

#19 | 2021-04-29

US20210121705A1

Human necessities

Electronics assembly for implantable medical device

#20 | 2020-05-14

US20200154567A1

Electricity

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

#21 | 2020-04-30

US20200135597A1

Electricity

Die carrier package and method of forming same

#22 | 2020-04-09

US20200111765A1

Electricity

ELECTRONIC ASSEMBLY AND METHOD OF FORMING SAME

#23 | 2020-04-02

US20200105961A1

Electricity

Integrated circuit package and system using same

#24 | 2020-02-20

US20200058567A1

Electricity

Integrated circuit package and method of forming same

#25 | 2018-11-22

US20180333586A1

Human necessities

Antenna for implantable medical devices

#26 | 2018-08-23

US20180236211A1

Human necessities

METHOD FOR APPLYING CONDUCTORS TO CATHETER BASED BALLOONS

#27 | 2017-01-12

US20170007420A1

Human necessities

Spinal implant system and method

#28 | 2016-06-16

US20160166825A1

Human necessities

Medical device with surface mounted lead connector

#29 | 2014-06-10

US13788310

Implantable medical device having a multi-axis magnetic sensor

#30 | 2013-02-07

US20130033286A1

Physics

Non-destructive tilt data measurement to detect defective bumps

InventorID:

75525 ⎘