Min Fu

City:

Changsha

Country:

China

Published Applications:

Last publication date:

2025-05-08

Top Assignees for applications by Min Fu

The entities that hold a legal rights for patent applications filed by inventor Fu Min:

Min Fu from Changsha, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

RUBBER PARTICLE-DOPED COMPOSITE CHIP SEAL AND CONSTRUCTION METHOD THEREOF

InventorID:

7571040 ⎘