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Inventor profile of:

BIN-KAI WANG

City:

Shenzhen

Country:

China

Published Applications:

1

Last publication date:

2025-09-18

Recent patent applications by WANG BIN-KAI

BIN-KAI WANG from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-18

US20250293191A1

METHOD AND SYSTEM FOR ASSEMBLING MICROELECTRONIC COMPONENTS

InventorID:

7575892 ⎘