Boise, Idaho
United States
30
2014-05-15
The entities that hold a legal rights for patent applications filed by inventor Benson Peter A.:
Peter A. Benson from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
APPARATUS FOR NON-CHEMICAL, NON-OPTICAL EDGE BEAD REMOVAL
#2 | 2012-09-20Non-chemical, non-optical edge bead removal process
#3 | 2012-06-05Non-chemical, non-optical edge bead removal process
#4 | 2012-05-03Wafer-level packaged microelectronic imagers having interconnects formed through terminals
#5 | 2009-06-18Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#6 | 2008-11-13Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects
#7 | 2007-11-08Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
#8 | 2007-08-02Substrate supports for use with programmable material consolidation apparatus and systems
#9 | 2007-07-26Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#10 | 2007-07-19Methods for supporting substrates during fabrication of one or more objects thereon by programmed material consolidation techniques
#11 | 2007-07-12Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
#12 | 2007-07-03Substrate supports for use with programmable material consolidation apparatus and systems
#13 | 2007-05-29Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
#14 | 2007-01-25Systems and methods for retrieving residual liquid during immersion lens photolithography
#15 | 2006-11-23Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#16 | 2006-11-23Microelectronic imagers and methods of packaging microelectronic imagers
#17 | 2006-11-02Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#18 | 2006-09-28Microelectronics devices, having vias, and packaged microelectronic devices having vias
#19 | 2006-09-14Methods for packing microfeature devices and microfeature devices formed by such methods
#20 | 2006-09-14Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures
#21 | 2006-08-31Semiconductor wafer assemblies
#22 | 2006-08-31Apparatus for spin coating semiconductor substrates
#23 | 2006-03-02Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
#24 | 2006-01-19Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
#25 | 2005-12-15Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
#26 | 2005-12-15Microelectronic imagers and methods of packaging microelectronic imagers
#27 | 2005-11-17Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
#28 | 2005-11-03Wafer edge ring structures and methods of formation
#29 | 2005-05-19Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#30 | 2005-05-19Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures
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