Mie
Japan
6
2015-12-31
The entities that hold a legal rights for patent applications filed by inventor SONODA Tetsuya:
Tetsuya SONODA from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Wiring module and method for assembling wiring module
#2 | 2015-11-12Wire harness
#3 | 2015-10-08WIRE HARNESS
#4 | 2015-10-01Wire harness and method for manufacturing wire harness
#5 | 2014-05-29Wire harness and method of manufacturing wire harness
#6 | 2014-05-15WIRE HARNESS
758495 ⎘