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Inventor profile of:

Daisuke IKEDA

City:

Suwa

Country:

Japan

Published Applications:

2

Last publication date:

2025-10-02

Recent patent applications by IKEDA Daisuke

Daisuke IKEDA from Suwa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250304775A1

Chemistry; metallurgy

Molding Material

#2 | 2025-10-02

US20250304774A1

Chemistry; metallurgy

Molding Material

InventorID:

7587076 ⎘