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Inventor profile of:

Heeil CHAE

City:

Hwaseong-si

Country:

South Korea

Published Applications:

1

Last publication date:

2025-10-02

Recent patent applications by CHAE Heeil

Heeil CHAE from Hwaseong-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250308765A1

LOOPBACK CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

InventorID:

7590318 ⎘