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Inventor profile of:

Derek Mong

City:

Malaysia

Country:

Malaysia

Published Applications:

1

Last publication date:

2025-10-02

Recent patent applications by Mong Derek

Derek Mong from Malaysia, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250309018A1

ENCAPSULATED SEMICONDUCTOR PACKAGES INCLUDING MULTIFUNCTIONAL INTERFACE MATERIAL (MIM) STRUCTURES

InventorID:

7590500 ⎘