🔗 Permalink

Inventor profile of:

Jack Round

City:

Omaha, Nebraska

Country:

United States

Published Applications:

1

Last publication date:

2025-10-14

Recent patent applications by Round Jack

Jack Round from Omaha, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-14

US17876766

Performing operations; transporting

System for organizing physical files in a folder matrix with two dimensional and linear storage/retrieval capability

InventorID:

7598240 ⎘