Ryo Katou

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-02-15

Top Assignees for applications by Ryo Katou

The entities that hold a legal rights for patent applications filed by inventor Katou Ryo:

OSAKA SODA CO., LTD. 2 Osaka, Japan
THE SCHOOL CORPORATION KANSAI UNIVERSITY 1 Suita, Japan

Recent patent applications by Katou Ryo

Ryo Katou from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15

US20240052213A1

Chemistry; metallurgy

ELECTRICALLY CONDUCTIVE ADHESIVE, SINTERED BODY OF ELECTRICALLY CONDUCTIVE ADHESIVE, METHOD FOR PRODUCING SINTERED BODY, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

#2 | 2023-09-28

US20230303895A1

Chemistry; metallurgy

ELECTROCONDUCTIVE ADHESIVE

InventorID:

7598404 ⎘