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Inventor profile of:

Shaffer BOND

City:

New York, New York

Country:

United States

Published Applications:

1

Last publication date:

2025-11-06

Recent patent applications by BOND Shaffer

Shaffer BOND from New York, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-06

US20250342471A1

ACCOUNT VERIFICATION WITH MICRODEPOSITS

InventorID:

7620105 ⎘