Eric Wayne Burger, II

City:

Everett, Washington

Country:

United States

Published Applications:

Last publication date:

2025-11-13

Top Assignees for applications by Eric Wayne Burger, II

The entities that hold a legal rights for patent applications filed by inventor Burger, II Eric Wayne:

The Boeing Company 1 Arlington, VA United States

Recent patent applications by Burger, II Eric Wayne

Eric Wayne Burger, II from Everett, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-13

US20250347363A1

Mechanical engineering

Assembly to Form a Seal on a Conduit

#2 | 2025-11-11

US18659209

Mechanical engineering

Assembly to form a seal on a conduit

InventorID:

7621751 ⎘