Ankit Bhushan SHARMA

City:

Erding

Country:

Germany

Published Applications:

Last publication date:

2026-06-25

Top Assignees for applications by Ankit Bhushan SHARMA

The entities that hold a legal rights for patent applications filed by inventor SHARMA Ankit Bhushan:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 5 Scottsdale, AZ United States

Recent patent applications by SHARMA Ankit Bhushan

Ankit Bhushan SHARMA from Erding, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-25

US20260182443A1

Electricity

CHIP SCALE PACKAGING WITH DOUBLE-SIDED PLATING FOR EMBEDDED DEVICES

#2 | 2026-06-25

US20260182440A1

Electricity

EMBEDDED SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE

#3 | 2026-06-25

US20260182397A1

Electricity

EMBEDDED SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE

#4 | 2026-06-25

US20260181781A1

Electricity

PANEL LEVEL PACKAGING FOR MODULAR EMBEDDED DEVICES

#5 | 2025-11-20

US20250357282A1

Electricity

DEVICE PACKAGE HAVING A CAVITY WITH SLOPED SIDEWALLS

InventorID:

7633291 ⎘