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Inventor profile of:

Daisuke ASA

City:

Tokyo

Country:

Japan

Published Applications:

3

Last publication date:

2025-11-27

Recent patent applications by ASA Daisuke

Daisuke ASA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27

US20250365850A1

ELECTRONIC DEVICE

#2 | 2025-11-27

US20250365849A1

MODULE UNIT AND ELECTRONIC DEVICE

#3 | 2025-11-27

US20250364520A1

COMPOSITE MODULE UNIT AND SYSTEM SUBSTRATE

InventorID:

7639231 ⎘