🔗 Permalink

Inventor profile of:

TREVOR SMITH

City:

GUELPH

Country:

Canada

Published Applications:

1

Last publication date:

2025-11-27

Recent patent applications by SMITH TREVOR

TREVOR SMITH from GUELPH, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27

US20250366262A1

ULTRA-THIN STRAIN-RELIEVING SI1-XGEX LAYERS ENABLING III-V EPITAXY ON SI

InventorID:

7639959 ⎘