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Inventor profile of:

Mohan Yu

City:

Shanghai

Country:

China

Published Applications:

1

Last publication date:

2025-12-11

Recent patent applications by Yu Mohan

Mohan Yu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-11

US20250380514A1

CLAMPING ARRANGEMENTS AND CLAMPING CIRCUITS

InventorID:

7653097 ⎘