Ming HE

City:

JIANGSU

Country:

China

Published Applications:

Last publication date:

2026-01-01

Top Assignees for applications by Ming HE

The entities that hold a legal rights for patent applications filed by inventor HE Ming:

Ming HE from JIANGSU, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

WAFER-SCALE SYSTEM-IN-PACKAGE STRUCTURE AND FORMING METHOD THEREOF

InventorID:

7670664 ⎘