William Giancola

City:

Ballwin, Missouri

Country:

United States

Published Applications:

Last publication date:

2014-05-22

Top Assignees for applications by William Giancola

The entities that hold a legal rights for patent applications filed by inventor Giancola William:

William Giancola from Ballwin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Electrical circuit protection device enclosure assembly and kit with device compatibility attachment

InventorID:

767101 ⎘