Andrew Simon

City:

Fishkill, New York

Country:

United States

Published Applications:

Last publication date:

2014-05-22

Top Assignees for applications by Andrew Simon

The entities that hold a legal rights for patent applications filed by inventor Simon Andrew:

Andrew Simon from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

SANDWICHED DIFFUSION BARRIER AND METAL LINER FOR AN INTERCONNECT STRUCTURE

Copper seed layer for an interconnect structure having a doping concentration level gradient

Dual damascene interconnect structures having different materials for line and via conductors

Constant emissivity deposition member

Dual damascene interconnect structures having different materials for line and via conductors

Dual damascene interconnect structures having different materials for line and via conductors

InventorID:

767925 ⎘