Mingming WU

City:

Ningbo

Country:

China

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Mingming WU

The entities that hold a legal rights for patent applications filed by inventor WU Mingming:

Mingming WU from Ningbo, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

PAD, LEAD FRAME, AND SENSOR PACKAGING STRUCTURE FOR ATTENUATING EDDY CURRENT EFFECT

LEAD-WIRE FRAME STRUCTURE FOR PACKAGING AND SENSOR PACKAGE STRUCTURE

PACKAGED CHIP AND CURRENT SENSOR

InventorID:

7686849 ⎘