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Inventor profile of:

Ming Jun LI

City:

Hsinchu

Country:

Taiwan

Published Applications:

1

Last publication date:

2026-01-22

Recent patent applications by LI Ming Jun

Ming Jun LI from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-22

US20260026314A1

GALVANIC EFFECT MONITOR TEST STRUCTURE FOR IC PACKAGE INTERPOSER

InventorID:

7688910 ⎘