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Inventor profile of:

Daisuke MAEDA

City:

Hitachi-shi

Country:

Japan

Published Applications:

1

Last publication date:

2026-01-29

Recent patent applications by MAEDA Daisuke

Daisuke MAEDA from Hitachi-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-29

US20260031295A1

SEMICONDUCTOR DC BREAKER AND SEMICONDUCTOR MODULE

InventorID:

7694155 ⎘