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Inventor profile of:

Jiahui CHEN

City:

CHENGDU

Country:

China

Published Applications:

1

Last publication date:

2026-02-19

Recent patent applications by CHEN Jiahui

Jiahui CHEN from CHENGDU, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-19

US20260053044A1

FORMING SEMICONDUCTOR CHIP PACKAGE WITH A SACRIFICAL LAYER

InventorID:

7712168 ⎘