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Inventor profile of:

Mingjun JI

City:

Changzhou

Country:

China

Published Applications:

1

Last publication date:

2026-03-05

Recent patent applications by JI Mingjun

Mingjun JI from Changzhou, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-05

US20260066624A1

LAPLESS MAIN CIRCUIT CONNECTION STRUCTURE AND UNIT ASSEMBLY

InventorID:

7724612 ⎘