Braden Henderson

City:

Mountain View, California

Country:

United States

Published Applications:

Last publication date:

2026-03-12

Recent patent applications by Henderson Braden

Braden Henderson from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12

US20260076190A1

Electricity

RECONSTITUTED WAFER PRODUCT WITH VARIABLE THICKNESS DIES CONTAINING DIAMOND

#2 | 2026-03-12

US20260076189A1

Electricity

Single Crystal Diamond Dies Packaged with Ultrathin Pocketed Semiconductor Wafer

#3 | 2026-03-12

US20260076188A1

Electricity

Single Crystal Diamond Dies Packaged with Ultrathin Pocketed Semiconductor Wafer

#4 | 2026-03-12

US20260076187A1

Electricity

Single Crystal Diamond Dies Packaged with Ultrathin Semiconductor Wafer

InventorID:

7732166 ⎘