John E. Cunningham

High-power packaged laser array

Extracting an embedded DC signal to provide a reference voltage for an optical receiver

Electro-refraction modulator with a regrown junction

Single shot correction of resonant optical components

Packaged opto-electronic module

Ferroelectric-enhanced tuning of ring resonators by using fields parallel to and above a top surface thereof

Temperature-insensitive optical component

Integrated electro-absorption modulator

Surface-normal coupler for silicon-on-insulator platforms

ELECTROPLATED SOLDER WITH EUTECTIC CHEMICAL COMPOSITION

Integrated electro-absorption modulator

Vertical integration of a hybrid optical source

Grating coupler for inter-chip optical coupling

WAVEGUIDE-COUPLED VERTICAL CAVITY LASER

Electroplated solder for high-temperature interconnect

Transfer of light signals between optical devices

Hybrid integrated photonic chip package

Enhanced optical modulation using slow light

Tunable silicon grating couplers

Hybrid-integrated photonic chip package

Hybrid-integrated photonic chip package with an interposer

Hybrid-integrated photonic chip package with an interposer

Hybrid optical source with semiconductor reflector

Multi-chip module with self-populating positive features

Waveguide-coupled vertical cavity laser

LOW-COST CHIP PACKAGE FOR CHIP STACKS

Chip package for high-count chip stacks

Edge coupling of optical devices

Batch process for three-dimensional integration

Optical connector with reduced mechanical-alignment sensitivity

Maintaining alignment in a multi-chip module using a compressible structure

Energy-efficient optical source

Efficient inter-chip optical coupling

Direct interlayer optical coupler

Optical device on inverted, substrateless chip

Wavelength-division multiplexing for use in multi-chip systems

Ultra-compact photodetector on an optical waveguide

Hybrid substrateless device with enhanced tuning efficiency

Interconnection and assembly of three-dimensional chip packages

Chip package to support high-frequency processors

Chip package with reinforced positive alignment features

Three-dimensional macro-chip including optical interconnects

Method for fabricating multi-chip module with multi-level interposer

Wavelength-division multiplexing for use in multi-chip systems

Mechanical coupling in a multi-chip module using magnetic components

Optical device with enhanced mechanical strength

Optical device with reduced thermal tuning energy

Optical modulator with three-dimensional waveguide tapers

MONOLITHIC LASER SOURCE USING RING-RESONATOR REFLECTORS

Waveguide electro-absorption modulator

Structures and methods for adjusting the wavelengths of lasers via temperature control

Misalignment compensation for proximity communication

Self-assembly of micro-structures

Assembly of multi-chip modules with proximity connectors using reflowable features

Optical device with high thermal tuning efficiency

Adhesive-bonded substrates in a multi-chip module

Multi-chip module with multi-level interposer

Electro-optic modulator with inverse tapered waveguides

Fault-tolerant multi-chip module

Integrated-circuit package for proximity communication

Three-dimensional macro-chip including optical interconnects

Mechanical coupling in a multi-chip module using magnetic components

Macro-chip including a surface-normal device

Optical device with reduced thermal tuning energy

Optical connector with reduced mechanical-alignment sensitivity

Technique for fabricating microsprings on non-planar surfaces

Low-latency switch using optical and electrical proximity communication

Optical device with large thermal impedance

Optical-signal-path routing in a multi-chip system

Broadband and wavelength-selective bidirectional 3-way optical splitter

Multi-chip system including capacitively coupled and optical communication

Multi-chip systems using on-chip photonics

Thermal tuning of an optical device

Dual-layer thermally tuned optical device

Optical device with large thermal impedance

Electrical contacts on top of waveguide structures for efficient optical modulation in silicon photonic devices

Dielectric enhancements to chip-to-chip capacitive proximity communication

Multi-phase clocking of integrated circuits using photonics

Misalignment compensation for proximity communication

Collision detection scheme for optical interconnects

Arbitration scheme for an optical bus

Clocking of integrated circuits using photonics

Method and apparatus for facilitating proximity communication and power delivery

Apparatus for facilitating proximity communication between chips

Integrated ring modulator array WDM transceiver

Proximity communication package for processor, cache and memory

Alignment features for proximity communication

Integrated-circuit package for proximity communication

Multi-chip systems with optical bypass

Method and apparatus for coupling optical signals onto a semiconductor chip

Transparent switch using optical and electrical proximity communication

Structures and methods for adjusting the wavelengths of lasers via temperature control

Method and apparatus for precisely aligning integrated circuit chips

Methods and structures for facilitating proximity communication

Optical imaging device for optical proximity communication

Resonator system for optical proximity communication

Method and apparatus for facilitating proximity communication and power delivery

Structures and methods for proximity communication using bridge chips