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Inventor profile of:

Kento Suwa

City:

Tokyo

Country:

Japan

Published Applications:

4

Last publication date:

2026-05-14

Recent patent applications by Suwa Kento

Kento Suwa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-14
US20260133566A1
Physics

Information Processing Apparatus, Defect Detection Method, and Three-Dimensional Powder Bed Fusion Additive Manufacturing Apparatus

#2 | 2026-05-14
US20260131539A1
Performing operations; transporting

Information Processing Apparatus, Defect Detection Method, and Three-Dimensional Powder Bed Fusion Additive Manufacturing Apparatus

#3 | 2026-04-30
US20260116014A1
Performing operations; transporting

Information Processing Apparatus, Defect Detection Method, and Three-Dimensional Powder Bed Fusion Additive Manufacturing Apparatus

#4 | 2026-04-30
US20260115799A1
Performing operations; transporting

Information Processing Apparatus, Defect Detection Method, and Three-Dimensional Powder Bed Fusion Additive Manufacturing Apparatus

InventorID:

7769345 ⎘

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