William S. Dernell

City:

Potlatch, Idaho

Country:

United States

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by William S. Dernell

The entities that hold a legal rights for patent applications filed by inventor Dernell William S.:

WASHINGTON STATE UNIVERSITY 1 Pullman, WA United States

Recent patent applications by Dernell William S.

William S. Dernell from Potlatch, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07

US20260125779A1

Chemistry; metallurgy

ALLOYS FOR IMPLANTS

InventorID:

7778165 ⎘