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Inventor profile of:

Su-Wen CHEN

City:

Bend, Oregon

Country:

United States

Published Applications:

1

Last publication date:

2026-05-14

Recent patent applications by CHEN Su-Wen

Su-Wen CHEN from Bend, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-14

US20260136976A1

MECHANICAL SUBSTRATE WITH MATCHED COEFFICIENT OF THERMAL EXPANSION

InventorID:

7787026 ⎘