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Inventor profile of:

Daniel Budolak

City:

Tehachapi, California

Country:

United States

Published Applications:

1

Last publication date:

2026-05-21

Recent patent applications by Budolak Daniel

Daniel Budolak from Tehachapi, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21

US20260142391A1

LEAD WIRE ATTACHMENT COMPONENT FOR ELASTIC SENSORS

InventorID:

7792593 ⎘