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Inventor profile of:

Bowei DAI

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2026-05-28

Recent patent applications by DAI Bowei

Bowei DAI from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-28

US20260150634A1

HARD MASK STRUCTURE FOR INTEGRATED CIRCUIT MANUFACTURING, AND METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE

InventorID:

7799559 ⎘