Hai AO

City:

Ottawa

Country:

Canada

Published Applications:

Last publication date:

2026-05-28

Recent patent applications by AO Hai

Hai AO from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

THREE-DIMENSIONAL STACKED CHIP AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL STACKED CHIP AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL STACKED CHIP AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL STACKED CHIP AND METHOD FOR MANUFACTURING THE SAME

InventorID:

7799573 ⎘