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Inventor profile of:

Tjibbe DE VRIES

City:

Eindhoven

Country:

Netherlands

Published Applications:

1

Last publication date:

2026-06-18

Recent patent applications by DE VRIES Tjibbe

Tjibbe DE VRIES from Eindhoven, NL has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-18

US20260173943A1

A METHOD FOR BONDING A FIRST AND SECOND PLANAR SUBSTRATE

InventorID:

7819318 ⎘