Soonwon LIM

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-06-25

Top Assignees for applications by Soonwon LIM

The entities that hold a legal rights for patent applications filed by inventor LIM Soonwon:

Soonwon LIM from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF REDUCING ADHESIVE STRENGTH OF ADHESION LAYER

InventorID:

7822409 ⎘