Robert Michael Smythe

City:

Ewing, New Jersey

Country:

United States

Published Applications:

Last publication date:

2014-12-25

Top Assignees for applications by Robert Michael Smythe

The entities that hold a legal rights for patent applications filed by inventor Smythe Robert Michael:

LAIRD TECHNOLOGIES, INC. 7 Chesterfield, MO United States
LAIRD TECHNOLOGIES, INC. 5 Earth City, MO United States
Laird Technologies, Inc. 1 Earth City, -

Recent patent applications by Smythe Robert Michael

Robert Michael Smythe from Ewing, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-25

US20140374080A1

Mechanical engineering

Compliant multilayered thermally-conductive interface assemblies

#2 | 2014-06-05

US20140150839A1

Mechanical engineering

Circuit assemblies including thermoelectric modules

#3 | 2012-08-09

US20120201008A1

Mechanical engineering

Circuit assemblies including thermoelectric modules

#4 | 2012-04-12

US20120087094A1

Mechanical engineering

Memory modules including compliant multilayered thermally-conductive interface assemblies

#5 | 2012-03-15

US20120061135A1

Electricity

COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES

#6 | 2011-02-10

US20110030754A1

Electricity

THERMOELECTRIC MODULES AND RELATED METHODS

#7 | 2011-01-06

US20110000516A1

Mechanical engineering

FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE FOR USE IN EXTRACTING POWER FROM OR DISSIPATING HEAT FROM FLUID CONDUITS

#8 | 2010-12-23

US20100321897A1

Performing operations; transporting

COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES

#9 | 2010-12-23

US20100321895A1

Mechanical engineering

Memory modules including compliant multilayered thermally-conductive interface assemblies

#10 | 2010-12-23

US20100319744A1

Electricity

Thermoelectric modules and related methods

InventorID:

782642 ⎘