Ayaka KURODA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-07-02

Recent patent applications by KURODA Ayaka

Ayaka KURODA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-07-02

US20260186413A1

Physics

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE OR PRINTED WIRING BOARD

InventorID:

7830780 ⎘