Pingping LI

City:

Jiangyin

Country:

China

Published Applications:

Last publication date:

2026-07-02

Top Assignees for applications by Pingping LI

The entities that hold a legal rights for patent applications filed by inventor LI Pingping:

Pingping LI from Jiangyin, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

WAFER SCALE SYSTEM-IN-PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

WAFER SCALE SYSTEM-IN-PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

InventorID:

7833892 ⎘