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Inventor profile of:

Keith E. DOWNES

City:

Stowe, Vermont

Country:

United States

Published Applications:

Last publication date:

2014-06-05

Top Assignees for applications by Keith E. DOWNES

The entities that hold a legal rights for patent applications filed by inventor DOWNES Keith E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 11 ARMONK, NY United States
INTERNATIONAL MACHINES CORPORATION 1 Armonk, NY United States
GlobalFoundries U.S. 2 LLC 1 Hopewell Junction, NY United States

Recent patent applications by DOWNES Keith E.

Keith E. DOWNES from Stowe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-06-05

US20140151899A1

Electricity

Dual-damascene process to fabricate thick wire structure

#2 | 2012-07-26

US20120190164A1

Electricity

Dual-damascene process to fabricate thick wire structure

#3 | 2012-07-19

US20120184081A1

Electricity

Process for single and multiple level metal-insulator-metal integration with a single mask

#4 | 2011-05-12

US20110108919A1

Electricity

METHOD OF FABRICATING A PRECISION BURIED RESISTOR

#5 | 2010-06-17

US20100149723A1

Electricity

Method and structure for creation of a metal insulator metal capacitor

#6 | 2010-01-14

US20100009509A1

Electricity

Dual-damascene process to fabricate thick wire structure

#7 | 2007-11-15

US20070262416A1

Electricity

Method and structure for creation of a metal insulator metal capacitor

#8 | 2007-08-23

US20070194390A1

Electricity

Method of fabricating a precision buried resistor

#9 | 2007-08-16

US20070190718A1

Electricity

Dual-damascene process to fabricate thick wire structure

#10 | 2007-07-05

US20070155164A1

Electricity

Metal seed layer deposition

#11 | 2007-03-22

US20070065966A1

Electricity

Process for single and multiple level metal-insulator-metal integration with a single mask

#12 | 2005-11-17

US20050253265A1

Electricity

Metal seed layer deposition

InventorID:

783855 ⎘