Sung-jun Im

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

Last publication date:

2014-06-05

Top Assignees for applications by Sung-jun Im

The entities that hold a legal rights for patent applications filed by inventor Im Sung-jun:

Sung-jun Im from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of manufacturing chip-stacked semiconductor package

Semiconductor device including thermally dissipating dummy pads

InventorID:

787231 ⎘