Inventor profile of:

William Mark Hiatt

City:

Eagle, Idaho

Country:

United States

Published Applications:

14

Last publication date:

2018-12-13

Top Assignees for applications by William Mark Hiatt

The entities that hold a legal rights for patent applications filed by inventor Hiatt William Mark:

Recent patent applications by Hiatt William Mark

William Mark Hiatt from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-12-13
US20180358263A1
Electricity

Semiconductor devices comprising nickel— and copper—containing interconnects

#2 | 2017-10-05
US20170283954A1
Chemistry; metallurgy

Semiconductor devices comprising nickel- and copper-containing interconnects

#3 | 2014-06-05
US20140154879A1
Electricity

Methods of forming interconnects and semiconductor structures

#4 | 2011-06-09
US20110136336A1
Electricity

Methods of forming conductive vias

#5 | 2011-04-28
US20110095429A1
Electricity

Methods for fabricating and filling conductive vias and conductive vias so formed

#6 | 2009-06-18
US20090155949A1
Electricity

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

#7 | 2007-08-09
US20070184654A1
Electricity

Methods for fabricating and filling conductive vias and conductive vias so formed

#8 | 2007-07-26
US20070170350A1
Electricity

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

#9 | 2007-03-01
US20070045632A1
Electricity

Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level

#10 | 2006-11-02
US20060243889A1
Electricity

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

#11 | 2006-08-08
US10701128
-

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

#12 | 2006-03-16
US20060057774A1
Electricity

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

#13 | 2006-01-19
US20060011809A1
Electricity

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

#14 | 2005-10-27
US20050236708A1
Electricity

Methods of packaging microelectronic imaging devices

InventorID:

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