Inventor profile of:

Brian Samuel Beaman

City:

Apex, North Carolina

Country:

United States

Published Applications:

18

Last publication date:

2016-08-25

Top Assignees for applications by Brian Samuel Beaman

The entities that hold a legal rights for patent applications filed by inventor Beaman Brian Samuel:

Recent patent applications by Beaman Brian Samuel

Brian Samuel Beaman from Apex, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-08-25
US20160249454A1
Electricity

Printed circuit board edge connector

#2 | 2016-08-04
US20160226166A1
Electricity

Electromechanical assembly with socket and card edge connector

#3 | 2014-07-10
US20140191775A1
Physics

Coaxial probe structure of elongated electrical conductors projecting from a support structure

#4 | 2014-06-12
US20140158404A1
Electricity

Printed circuit board edge connector

#5 | 2014-06-12
US20140158403A1
Electricity

Printed circuit board edge connector

#6 | 2013-07-16
US10066171
-

Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface

#7 | 2011-11-03
US20110266042A1
Electricity

Printed circuit board edge connector

#8 | 2009-12-17
US20090308756A1
Physics

Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure

#9 | 2009-07-30
US20090189288A1
Performing operations; transporting

ANGLED FLYING LEAD WIRE BONDING PROCESS

#10 | 2009-02-24
US10736890
-

Angled flying lead wire bonding process

#11 | 2008-07-31
US20080182443A1
Electricity

Socket and method for compensating for differing coefficients of thermal expansion

#12 | 2008-07-10
US20080164896A1
Physics

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

#13 | 2008-05-06
US10202069
-

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

#14 | 2008-04-17
US20080090440A1
Electricity

Socket and method for compensating for differing coefficients of thermal expansion

#15 | 2008-04-17
US20080090439A1
Electricity

Method for manufacturing a socket that compensates for differing coefficients of thermal expansion

#16 | 2007-12-04
US11548789
-

Socket and method for compensating for differing coefficients of thermal expansion

#17 | 2007-10-16
US9254769
-

Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof

#18 | 2005-05-10
US9165832
-

Plated probe structure

InventorID:

791702 ⎘