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Inventor profile of:

Daisuke SHIMIZU

City:

Osaka

Country:

Japan

Published Applications:

7

Last publication date:

2022-05-19

Top Assignees for applications by Daisuke SHIMIZU

The entities that hold a legal rights for patent applications filed by inventor SHIMIZU Daisuke:

  • FUNAI ELECTRIC CO., LTD. 3 Osaka, Japan
  • Funai Electric Co., Ltd. 1 Daito-shi, Japan
  • SEKISUI PLASTICS CO., LTD. 1 Osaka, Japan

Recent patent applications by SHIMIZU Daisuke

Daisuke SHIMIZU from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-05-19
US20220153949A1
Chemistry; metallurgy

Plant-derived polyamide-based elastomer foam molded body, method for manufacturing same, and foam particles thereof

#2 | 2021-08-26
US20210265421A1
Electricity

THERMOELECTRIC CONVERSION MODULE

#3 | 2021-07-15
US20210217945A1
Electricity

THERMOELECTRIC CONVERSION MODULE, AND COOLING DEVICE, TEMPERATURE MEASURING DEVICE, HEAT FLUX SENSOR, OR POWER GENERATING DEVICE INCLUDING SAME

#4 | 2015-08-20
US20150234263A1
Physics

Projector and Headup Display

#5 | 2014-10-02
US20140293239A1
Physics

PROJECTOR AND HEAD-UP DISPLAY DEVICE

#6 | 2014-06-12
US20140160447A1
Physics

IMAGE DISPLAY DEVICE

#7 | 2006-03-09
US20060049573A1
Performing operations; transporting

Image forming apparatus with offset feed roller from separation portion

InventorID:

793939 ⎘

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