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Inventor profile of:

Lay Yeap Lim

City:

Penang

Country:

Malaysia

Published Applications:

7

Last publication date:

2014-06-19

Top Assignees for applications by Lay Yeap Lim

The entities that hold a legal rights for patent applications filed by inventor Lim Lay Yeap:

  • Fairchild Semiconductor Corporation 5 South Portland, ME United States
  • FAIRCHILD SEMICONDUCTOR CORPORATION 2 San Jose, CA United States

Recent patent applications by Lim Lay Yeap

Lay Yeap Lim from Penang, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-06-19
US20140167238A1
Electricity

Semiconductor die package and method for making the same

#2 | 2012-07-19
US20120181675A1
Electricity

Semiconductor die package and method for making the same

#3 | 2010-10-14
US20100258925A1
Electricity

Semiconductor die package and method for making the same

#4 | 2010-06-03
US20100136750A1
Electricity

Etched leadframe structure

#5 | 2009-09-24
US20090236711A1
Electricity

Method of making and designing lead frames for semiconductor packages

#6 | 2008-10-23
US20080258272A1
Electricity

Etched leadframe structure including recesses

#7 | 2007-01-04
US20070001278A1
Electricity

Semiconductor die package and method for making the same

InventorID:

802297 ⎘

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