Shusuke Yoshihara

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2018-10-18

Top Assignees for applications by Shusuke Yoshihara

The entities that hold a legal rights for patent applications filed by inventor Yoshihara Shusuke:

Shusuke Yoshihara from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

RESIN COMPOSITION, SEMI-CURED THERMALLY CONDUCTIVE FILM USING SAME, CIRCUIT BOARD AND ADHESIVE SHEET

Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same

Thermally-conductive organic additive, resin composition, and cured product

Thermoplastic resin with high thermal conductivity

Thermoplastic resin with high thermal conductivity

THERMALLY-CONDUCTIVE ORGANIC ADDITIVE, RESIN COMPOSITION, AND CURED PRODUCT

Highly thermally conductive thermoplastic resin composition and thermoplastic resin

InventorID:

80394 ⎘