Daisuke MURAKAMI

City:

Hyogo

Country:

Japan

Published Applications:

Last publication date:

2014-06-26

Top Assignees for applications by Daisuke MURAKAMI

The entities that hold a legal rights for patent applications filed by inventor MURAKAMI Daisuke:

Daisuke MURAKAMI from Hyogo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Sintered compact, cutting tool formed using sintered compact, and method for manufacturing sintered compact

Vibration suppressing cutting tool

InventorID:

814100 ⎘