Ryota MITA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-12-19

Top Assignees for applications by Ryota MITA

The entities that hold a legal rights for patent applications filed by inventor MITA Ryota:

NITTO DENKO CORPORATION 8 Osaka, Japan
NITTO DENKO CORPORATION 2 Ibaraki-shi, Osaka, Japan
NITTO DENKO CORPORATION 2 Ibaraki, Japan

Recent patent applications by MITA Ryota

Ryota MITA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-19

US20240421010A1

Electricity

SINTER BONDING SHEET ROLL

#2 | 2024-12-12

US20240413116A1

Electricity

SINTER BONDING SHEET

#3 | 2020-09-17

US20200294961A1

Electricity

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BASE MATERIAL

#4 | 2020-09-17

US20200294952A1

Electricity

SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE MATERIAL, AND SEMICONDUCTOR CHIP WITH LAYER OF MATERIAL FOR SINTERING BONDING

#5 | 2020-09-17

US20200294951A1

Electricity

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BASE MATERIAL

#6 | 2020-09-17

US20200290833A1

Performing operations; transporting

Wound body of sheet for sintering bonding with base material

#7 | 2020-09-17

US20200290160A1

Performing operations; transporting

Sheet for sintering bonding and sheet for sintering bonding with base material

#8 | 2017-06-01

US20170152357A1

Chemistry; metallurgy

ENCAPSULATING SHEET, PRODUCTION METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE AND ENCAPSULATED OPTICAL SEMICONDUCTOR ELEMENT

#9 | 2016-06-23

US20160176160A1

Performing operations; transporting

RELEASE SHEET AND RELEASE SHEET-INCLUDING SILICONE RESIN SHEET

#10 | 2014-06-26

US20140178678A1

Electricity

ENCAPSULATING SHEET

InventorID:

814877 ⎘