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Inventor profile of:

David J. Zapp

City:

Simi Valley, California

Country:

United States

Published Applications:

7

Last publication date:

2014-09-18

Top Assignees for applications by David J. Zapp

The entities that hold a legal rights for patent applications filed by inventor Zapp David J.:

  • SKYWORKS SOLUTIONS, INC. 7 Woburn, MA United States

Recent patent applications by Zapp David J.

David J. Zapp from Simi Valley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-09-18
US20140262053A1
Performing operations; transporting

Debonders and related devices and methods for semiconductor fabrication

#2 | 2014-07-03
US20140182762A1
Electricity

Securing mechanism and method for wafer bonder

#3 | 2012-04-05
US20120080832A1
Electricity

DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS

#4 | 2012-04-05
US20120080150A1
Electricity

Fixtures and methods for unbonding wafers by shear force

#5 | 2012-04-05
US20120080132A1
Performing operations; transporting

Securing mechanism and method for wafer bonder

#6 | 2012-04-05
US20120080052A1
Electricity

Devices and methodologies for handling wafers

#7 | 2011-12-08
US20110297329A1
Performing operations; transporting

Debonders and related devices and methods for semiconductor fabrication

InventorID:

819660 ⎘

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