Jun Woo LEE

City:

Uiwang-si

Country:

South Korea

Published Applications:

Last publication date:

2014-10-16

Top Assignees for applications by Jun Woo LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Jun Woo:

Jun Woo LEE from Uiwang-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Dicing die-bonding film and method of forming a cut on the dicing die-bonding film

Adhesive composition for semiconductor and adhesive film including the same

ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM

InventorID:

823792 ⎘