Cong Wang

City:

Evanston, Illinois

Country:

United States

Published Applications:

Last publication date:

2015-11-26

Top Assignees for applications by Cong Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Cong:

Cong Wang from Evanston, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Bonded abrasive article and method of grinding

Abrasive article with hybrid bond

Bonded abrasive article and method of grinding

Bonded abrasive article and method of grinding

Bonded abrasive article and method of grinding

InventorID:

824463 ⎘