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Inventor profile of:

Wei WANG

City:

Suzhou

Country:

China

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Wei WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Wei:

China Wafer Level CSP Co., Ltd. 8 Suzhou, Jiangsu, China
China Wafer Level CSP Co., Ltd. 8 Suzhou, China
TOPCONN ELECTRONIC (KUNSHAN) CO., LTD. 3 Suzhou, Jiangsu Province, China
SUZHOU LUXSHARE TECHNOLOGY CO., LTD. 2 Suzhou, China
Suzhou Luxshare Technology Co., Ltd. 2 Suzhou City, China
STEERING SOLUTIONS IP HOLDING CORPORATION 1 Saginaw, MI United States
China Wafer Level CSP Ltd. 1 Jiang Su Province, China
Topconn Electronic (Kunshan) Co., Ltd 1 Suzhou, China
Faraday Technology Corp. 1 Hsin-Chu, Taiwan
SUZHOU SUZHEN BIOENGINEERING CO., LTD 1 Suzhou, China
SUZHOU GSTARSOFT COMPANY LIMITED 1 Suzhou, China
FORD GLOBAL TECHNOLOGIES, LLC 1 Dearborn, MI United States

Recent patent applications by WANG Wei

Wei WANG from Suzhou, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12

US20260045080A1

Physics

IMAGE CLASSIFICATION METHOD, SYSTEM, ELECTRONIC DEVICE, AND STORAGE MEDIUM

#2 | 2024-04-11

US20240120631A1

Electricity

CAVITY FILTER

#3 | 2023-08-17

US20230257017A1

Performing operations; transporting

Electrically adjustable steering column and electric power steering system

#4 | 2023-04-27

US20230130667A1

Electricity

Cavity filter

#5 | 2021-11-04

US20210340086A1

Chemistry; metallurgy

Method for extracting polyol from a fermentation process

#6 | 2021-07-15

US20210216678A1

Physics

CAD COLLABORATIVE DESIGN SYSTEM

#7 | 2019-07-25

US20190228598A1

Physics

Cross-group messaging

#8 | 2019-04-23

US15925781

Physics

Voltage generating device and calibrating method thereof

#9 | 2018-03-08

US20180068977A1

Electricity

Chip packaging method and chip packaging structure

#10 | 2018-02-15

US20180047772A1

Electricity

Packaging method and packaging structure

#11 | 2017-10-05

US20170287797A1

Electricity

Chip packaging method and package structure

#12 | 2017-10-05

US20170284837A1

Physics

Wafer-level chip package structure and packaging method

#13 | 2017-06-08

US20170162620A1

Electricity

Fingerprint recognition chip packaging structure and packaging method

#14 | 2017-05-25

US20170147851A1

Physics

Fingerprint recognition chip packaging structure and packaging method

#15 | 2017-05-18

US20170140195A1

Physics

Fingerprint recognition chip packaging structure and packaging method

#16 | 2017-04-25

US15229571

Electricity

Electrical connector and differential signal assembly thereof

#17 | 2016-05-26

US20160148972A1

Electricity

Wafer-level packaging method of BSI image sensors having different cutting processes

#18 | 2015-10-13

US14336061

Electricity

Communication connector and transmission wafer thereof

#19 | 2015-07-16

US20150200153A1

Electricity

Chip to wafer package with top electrodes and method of forming

#20 | 2015-06-18

US20150171557A1

Electricity

Communication connector and transmission module thereof

#21 | 2015-05-21

US20150137294A1

Electricity

Image sensor package structure and method

#22 | 2015-02-26

US20150054109A1

Electricity

Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions

#23 | 2015-02-26

US20150054108A1

Electricity

Wafer level packaging structure for image sensors and wafer level packaging method for image sensors

#24 | 2014-07-10

US20140191352A1

Electricity

Wafer-level packaging method of BSI image sensors having different cutting processes

#25 | 2010-07-08

US20100171134A1

Electricity

OPTICAL CONVERTER AND MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DIODE

InventorID:

829604 ⎘